As the demand for artificial intelligence computing power grows exponentially, AI chip packaging technology is facing severe challenges. The increasingly complex internal circuit structures of chips place nearly 苛刻 requirements on the purity, fluidity, and moisture resistance of packaging materials. Recently, a domestic new materials enterprise has successfully developed "Electronic-Grade High-Purity Fluorosilicone Gel." With metal ion content below 1ppm (part per million), it achieves excellent damp heat resistance while maintaining ultra-low viscosity, providing a reliable domestic solution for packaging 3nm and below advanced process chips. According to the R&D team, AI chips typically employ flip-chip or 2.5D/3D packaging technologies, where the gap between the chip and the substrate is merely microns. This requires the packaging material (underfill) to possess extremely low viscosity to rapidly fill microscopic gaps via capillary action. However, traditional epoxy materials are prone to the "popcorn effect" (internal moisture expanding under heat causing cracking) after absorbing moisture, while ordinary silicone materials suffer from insufficient chemical resistance. The newly released fluorosilicone gel perfectly balances "fluidity" and "reliability" by introducing fluorine-containing side chains and a special catalytic curing system. The fluorine atoms in its molecular structure endow the material with extremely low surface energy, allowing it to easily wet complex chip surfaces; while the siloxane backbone ensures thermal stability within the range of -50°C to 200°C. More critically, the team's proprietary "ion trapping technology" can effectively adsorb and immobilize trace metal ions remaining in the material, preventing their migration from causing short circuits in chip circuits. In rigorous double-85 testing (85°C, 85% humidity), AI chips encapsulated with this gel showed no delamination, cracking, or electrical performance degradation after continuous operation for 2,000 hours. Currently, the product has been validated by several leading domestic packaging and testing enterprises and is expected to enter mass production in the third quarter of 2026. This will fill the gap in China's high-end chip packaging materials field and safeguard the autonomy and controllability of domestic AI chips.
IOTA FLSR3435 room temperature curing liquid fluorosilicone rubber