At the 2026 International New Display Technology Exhibition, a research and development achievement concerning "High-Refractive-Index Phenyl Silicone Rubber Encapsulation Material" was officially released. Through molecular structure innovation, this material has increased its refractive index to over 1.54 while maintaining excellent high-temperature resistance and UV aging resistance. It successfully solves key challenges in light extraction efficiency and long-term reliability for Micro-LED display devices, clearing a significant obstacle for the industrialization of China's next-generation display technology. According to the R&D team, as the core of next-generation display technology, Micro-LED chips are microscopic in size, and light extraction efficiency is a key factor restricting their brightness and energy efficiency. Traditional encapsulation materials, mostly common organic silicon or epoxy resin, generally have refractive indices lower than 1.50, causing a large amount of light to be lost due to total internal reflection at the interface between the chip and the encapsulation layer. Phenyl silicone rubber, due to the high electron polarizability of the phenyl groups in its molecular chain, inherently possesses the potential for a high refractive index. However, traditional materials with high phenyl content often suffer from poor thermal stability and a tendency to yellow. The newly released material introduces special side-chain modification technology and nano-composite processes. While significantly increasing the phenyl content, it effectively inhibits the degradation reaction of the material under high temperatures and strong light exposure. Test data shows that after aging at 150°C for 1,000 hours, the material maintains a light transmittance of over 98% with no obvious yellowing. Its high refractive index characteristic increases the light extraction efficiency of Micro-LED chips by approximately 25%, significantly reducing device power consumption. In addition, the material features low stress and high elasticity, effectively buffering the difference in thermal expansion coefficients between the chip and the substrate, preventing cracking or delamination of the device under thermal shock. Currently, the material has passed preliminary validation by several leading domestic display panel enterprises and is expected to begin small-batch trial production by the end of 2026, providing a solid material foundation for the widespread application of Micro-LED in smart wearables, automotive displays, and ultra-large-screen televisions.
Phenyl Methyl Silicone Oils IOTA 250-30