Aerospace electronics require encapsulation materials that withstand extreme environments with high long-term reliability. Hydroxyphenyl silicone rubber excels in low-temperature flexibility, radiation stability, and strong bonding capability, making it an ideal material for spacecraft thermal control systems, sensor encapsulation, and PCB protective coatings.

Built on hydroxyl and phenyl group structures, the material cures through addition or condensation to form dense, insulating silicone networks with excellent thermal and dimensional stability. It remains elastic at -90°C and provides strong dielectric performance and resistance to ionic migration.

Applications include chip potting, microwave module protection, and sealing of deployable solar mechanisms. As aerospace missions grow longer and more complex, hydroxyphenyl silicone rubber's resilience under harsh conditions positions it as a key material for deep-space, satellite, and orbital electronics.