With the rapid development of the electronics industry, there is a growing demand for advanced packaging materials, thermal interface materials, and high-temperature-resistant components. Hydroxyl phenyl silicone rubber, with its excellent heat resistance, electrical insulation, and aging resistance, is becoming a core material in electronic manufacturing.

Hydroxyl phenyl silicone rubber exhibits outstanding thermal stability, allowing it to function reliably in environments exceeding 200°C. This makes it ideal for applications such as chip packaging, circuit board coatings, and high-temperature cable insulation. Its low dielectric constant ensures excellent electrical performance in high-frequency environments, reducing signal loss and enhancing device stability.

Additionally, the material’s strong oxidation resistance and UV stability help extend the lifespan of electronic components. As the development of 5G communication, smart wearable devices, and high-performance computing accelerates, hydroxyl phenyl silicone rubber is expected to play a vital role in high-end electronic applications, pushing the industry toward new advancements.