Shanghai
XinZhiYi Semiconductor Material Co., Ltd. announced today that its
independently developed "Anti-Adhesion Fluorosilicone Rubber Mixture"
has completed pilot production and officially entered large-scale mass
production. This material successfully solves the technical problem of
fluorosilicone rubber's tendency to adhere to substrates during
long-term contact in semiconductor packaging through the introduction of
PFA resin microparticles and innovative crosslinking processes,
providing critical material support for wafer dicing and packaging
processes in China's chip manufacturing.
According
to the company's technical director, in the semiconductor packaging
process, fluorosilicone rubber is often used as a die attach film (DAF)
for wafer dicing and as a packaging sealant. However, traditional
fluorosilicone rubber tends to adhere to the thin film on the wafer
surface under high temperature and high pressure environments, leading
to reduced dicing precision and increased wafer breakage rates. The
newly developed anti-adhesion fluorosilicone rubber mixture uses
fluorosilicone rubber as the base, adding 10-30 parts by weight of
silica, 3-20 parts by weight of PFA resin microparticles, and other
additives. Through peroxide crosslinking and post-heat treatment, it
forms an "in-situ built-in" anti-adhesion interface on the material
surface, reducing peel force to below 0.1 N/cm while maintaining
excellent heat resistance and chemical resistance.
Test
data shows that die attach pads made from this material showed no
adhesion phenomena during 2,000 hours of continuous wafer dicing
testing, with dicing precision errors controlled within ±1 μm and wafer
breakage rates reduced to below 0.01%. Currently, the product has been
validated by several major domestic foundries and has signed long-term
supply agreements with a leading chip packaging enterprise. Industry
analysts believe this breakthrough will effectively reduce material loss
in China's chip manufacturing process, improve packaging efficiency and
product yield, and further consolidate China's position in the global
semiconductor industry chain.
Fluoro silicone gum IOTA 3110-F series
