At the 2026 Asian Silicone Technology Exchange Conference (ASTEC2026) which opened today, Shanghai XinZhiYi Semiconductor Material Co., Ltd. officially released its latest "Anti-Adhesion Fluorosilicone Rubber Mixture." Designed specifically for high-precision wafer dicing processes, this material successfully solves the technical pain point that has long plagued the semiconductor industry: the adhesion of fluorosilicone rubber die attach film (DAF) pads to substrates during prolonged contact. This marks a significant advancement for China in the field of key semiconductor consumables. According to the company's technical lead, during the wafer dicing process, the pad material must maintain extremely high dimensional stability under high temperature and pressure. Traditional materials tend to adhere to the thin film on the wafer surface after prolonged operation, leading to reduced dicing precision or even wafer scrapping. The newly released mixture innovatively introduces a controlled content of PFA (Perfluoroalkoxy alkane) resin microparticles. Combined with specific peroxide crosslinking and post-heat treatment processes, it constructs an "in-situ built-in" anti-adhesion interface on the material's surface. Test data shows that die attach pads made from this material maintained an extremely low peel force during a continuous 1,000-hour wafer dicing test, with no residue detected. Furthermore, the material balances excellent long-term heat resistance and chemical resistance, allowing it to operate stably in complex packaging environments. Currently, the product has been validated by several major domestic foundries and is expected to enter mass production in the third quarter of 2026. This will significantly reduce chip manufacturing costs and enhance the autonomy and controllability of the domestic semiconductor supply chain.
IOTA FLSR3040 Fluorosilicone potting adhesive