At the 2026 Global Semiconductor Thermal Management Technology Summit, Zhejiang Zhongtian Oriental Fluorosilicon Materials Co., Ltd., jointly with the Quzhou Institute of Zhejiang University, officially released a new phenyl-modified silicone oil coolant codenamed "SilCool-2026." Designed specifically for immersion liquid cooling systems in next-generation AI servers and chips with processes below 3nm, its core metric—a dielectric constant as low as 2.06—significantly outperforms the international standard of 2.26. This marks a successful breakthrough by China in breaking the long-standing technical monopoly held by foreign entities in the field of high-end electronic chemicals. With the exponential growth in computing power requirements for AI large models, the Thermal Design Power (TDP) of chips has exceeded 1000W, pushing traditional air cooling to its physical limits. Through molecular structure design, the R&D team introduced bulky phenyl groups into the polysiloxane backbone, which not only effectively reduced the material's dielectric constant and loss tangent but also significantly improved thermal stability and flash point. Test data shows that the coolant remains undecomposed after 1,000 hours of continuous operation at 200°C and causes zero corrosion to metals like copper and aluminum. Currently, the product is undergoing trials at leading domestic supercomputing centers and is expected to significantly reduce energy costs for data centers, aiding the efficient implementation of the "East Data, West Computing" project.
High temperature resistant silicone oil IOTA 255