As 5G communications, artificial intelligence, and IoT devices evolve towards higher frequencies, speeds, and integration densities, electronic packaging technology faces unprecedented challenges in thermal management, insulation, and long-term reliability. Fluorosilicone rubber material series, leveraging their unique electrical properties, thermal stability, and process adaptability, are demonstrating growing importance in high-frequency, high-speed electronic packaging, establishing a critical defense line for ensuring the stable long-term operation of core chips and modules.

In millimeter-wave communications and high-speed computing, signal integrity imposes stringent demands on the dielectric properties of packaging materials. Specialized fluorosilicone potting compounds and addition-cure liquid fluorosilicone possess extremely low and stable dielectric constants and loss factors. This effectively minimizes signal attenuation and interference during high-frequency transmission, making them widely applicable for encapsulating and protecting RF front-end modules, antennas, and high-speed connectors. Their excellent heat resistance also meets the escalating thermal dissipation needs of modern chips.

For high-power-density devices such as GPUs, CPUs, and power management modules, heat and stress generated during prolonged operation are primary failure causes. The phenyl silicone rubber series, particularly methyl phenyl vinyl silicone rubber, offers not only superior electrical insulation but also high thermal decomposition temperatures and a low coefficient of thermal expansion. This effectively buffers thermal stress between the chip and substrate, preventing interfacial delamination. Meanwhile, highly flowable room-temperature curing (RTV) liquid fluorosilicone can fill micro-gaps, achieving comprehensive protection.

Furthermore, advanced packaging processes like Chiplet and 3D stacking impose extremely high demands on material purity and process compatibility. Ultra-high-purity fluorosilicone oil and hydroxy fluorosilicone oil serve as crucial interfacial treatment agents or additives, improving material wettability and reducing interfacial defects. Concurrently, new product forms such as pre-molded parts made from fluorosilicone millable gum and photo-curable liquid fluorosilicone materials are rapidly developing to meet the needs of automated production lines.

Industry experts note that future electronic packaging will trend towards heterogeneous integration and system-in-package designs, raising the bar for the comprehensive, customizable performance of packaging materials. The fluorosilicone materials industry is driving continuous evolution through fundamental research and process innovation, focusing on higher thermal conductivity, lower dielectric loss, stronger adhesion, and enhanced environmental friendliness, striving to become an indispensable "invisible guardian" within next-generation high-end electronic devices.

General fluorosilicone rubber IOTA FHTV 3260 series