Phenyl silicone rubber elastic paste has recently achieved a major technological breakthrough in the fields of high-end electronic packaging and precision instrument protection. This specialty material, which never cures and permanently maintains its viscoelasticity, is becoming the “flexible armor” for protecting electronic systems in 5G communications, aerospace, and new energy vehicles due to its exceptional environmental adaptability, stress buffering, and sealing performance, providing an innovative solution for the long-term reliability challenges of components under complex operating conditions.

Research shows that within an ultra-wide temperature range of -100°C to 250°C, the material’s loss factor (tanδ) remains stable within the optimal damping interval of 0.8-1.2, effectively absorbing and dissipating broadband vibration energy and reducing vibration acceleration transmissibility for precision chips by over 60%. Simultaneously, its extremely low compression set rate (≤5% at 100°C×22h) ensures dimensional stability for long-term filling. The material’s volume resistivity reaches as high as 10¹⁵ Ω·cm, providing reliable insulation protection for sensitive circuits.

In 5G millimeter-wave Active Antenna Units (AAUs), the material is precisely filled into micron-level gaps between high-power chips and heat sinks. It not only achieves efficient thermal conductivity as high as 1.5 W/(m·K) but also buffers the intense thermal stress caused by instantaneous power surges through its viscoelastic properties, increasing the fatigue life of critical solder joints by over 300%. In the new energy vehicle sector, the material is directly potted around power modules in motor controllers, successfully suppressing the “breathing effect” caused by temperature cycling, increasing the Mean Time Between Failures (MTBF) of modules under combined vibration and damp-heat stress to 2.8 times that of conventional solutions.

The material’s application in the aerospace field is particularly noteworthy. In satellite precision payloads and inertial navigation systems, its excellent conformal filling capability and extremely low outgassing characteristics enable perfect encapsulation of irregularly shaped components while ensuring the cleanliness of ultra-high vacuum environments. Industry experts point out that as electronic equipment evolves toward miniaturization and high power density, phenyl silicone rubber elastic paste is transitioning from a supplementary packaging material to a key core material ensuring the reliable operation of high-end electronic systems throughout their entire lifecycle, with broad market prospects.

Phenyl Elastomer IOTA BHTV 3036