With the rapid development of high-temperature electronic systems such as sensors, compact transformers, aerospace cables, and power electronics, the demand for materials that remain stable under heat, humidity, and strong electric fields is increasing. Hydroxyl phenyl silicone rubber, with its unique structure and outstanding performance, is emerging as a key material in high-end insulation, sealing, and potting applications.

This silicone rubber incorporates phenyl groups in the backbone and reactive hydroxyl terminals, providing excellent resistance to oxidation and thermal degradation. The presence of hydroxyl groups also enhances compatibility with other resin systems like epoxy and polyurethane. It offers long-term thermal stability up to 280°C, while maintaining excellent electrical insulation properties (volume resistivity ≥10¹⁵ Ω·cm, dielectric strength >20kV/mm).

Hydroxyl phenyl silicone rubber is widely used in high-temperature potting compounds, adhesive sealants for electronics, and encapsulants for heating film systems. It also demonstrates superior flexibility and reliability in battery packs for EVs, high-voltage insulators, and aerospace harnesses. Its reactive hydroxyl structure supports strong crosslinking with various curing agents, resulting in soft, transparent, crack-free elastomers upon curing.

To meet the rising needs of frontier technologies, current formulations have been optimized for low volatility, low ion migration, and customizable thermal conductivity. These advancements are enabling broader applications in 5G communications, high-frequency radar systems, and precision optoelectronics, positioning hydroxyl phenyl silicone rubber as a vital material for the future of high-performance electronics.