In aerospace, precision electronics, energy systems, and industrial maintenance, materials are required not only to offer high flexibility and moldability but also to endure high temperatures, radiation, and aggressive chemical environments. Phenyl silicone rubber putty—a non-flowing, highly moldable, room-temperature-curing compound—is emerging as a preferred solution for sealing, potting, and structural protection across various demanding applications.

Based on high-phenyl-content polysiloxane and enhanced with specialty tackifiers, inorganic fillers, and thermal stabilizers, this putty exhibits exceptional thermal resistance (up to +300°C), dielectric stability, and long-term elasticity. Its unique property lies in maintaining softness and flexibility even under heat, pressure, and chemical exposure, making it ideal for gap filling, sealing, and reshaping.

Common applications include:

• Gap filling and vibration damping in aerospace compartments and sealing interfaces;

• High-temperature potting for power transformers and precision sensors;

• Flame-retardant fillers for lithium battery modules and enclosures;

• On-site repair of leaks or cracks in industrial machinery under operation.

Its soft, pliable form conforms to irregular surfaces and complex geometries, simplifying application without the need for pressure tools. Once cured, it forms bubble-free, crack-resistant seals, improving product reliability and extending service life.

With the rise of smart manufacturing and advanced equipment, phenyl silicone rubber putty is also being upgraded with low-volatility and low-ion-migration formulations, enabling its safe use in semiconductors and cleanroom environments. It is now recognized as a flagship material for the next generation of flexible, high-temperature sealing technologies.