As electronics continue to miniaturize and demand higher reliability, packaging materials must meet tougher performance criteria. IOTA phenyl silicone elastic putty, with outstanding heat resistance, extrudability, and resilience, is becoming a new choice for high-end electronics encapsulation and protection.

Operating reliably from -80°C to +250°C, it offers low stress relaxation, excellent dielectric properties, and radiation resistance, protecting chips, PCBs, and sensors from thermal and mechanical shocks.

In high-frequency communications, avionics, and smart device manufacturing, the putty supports efficient dispensing, moldable protection, and removable shielding solutions while maintaining elasticity and adhesion—greatly enhancing product lifespan and reliability.

As the electronics industry advances toward smarter, harsher environment applications, IOTA phenyl silicone elastic putty will be a key material in ensuring device performance and durability.