With the explosive growth of AI and big data, data centers face unprecedented cooling challenges. Liquid cooling technology, as the key solution for high power density heat dissipation, is driving innovation in upstream fluid materials. Currently, cooling media centered on Fluorosilicone Oil and modified organosilicon fluids are becoming market favorites. Compared to traditional coolants, Fluorosilicone Oil possesses high chemical inertness, excellent thermal stability, and insulating properties, making it ideal for immersion liquid cooling systems. Meanwhile, Ethyl Silicone Oil, with its unique dielectric properties and viscosity stability across a wide temperature range, is widely used in thermal management systems for transformers and high-end electronic components. On the material side, besides liquid cooling media, solid sealing materials are equally critical. To prevent coolant leakage and cope with long-term thermal expansion and contraction, data center piping systems extensively use Solid Phenyl Silicone Rubber and Liquid Fluorosilicone Rubber. Among them, Phenyl Silicone Rubber is renowned for its exceptional high and low-temperature resistance, maintaining elasticity from -60°C to 250°C, ensuring long-term sealing reliability of cooling circuits. With improvements in the synthesis process of Phenyl Raw Gum, the cost-effectiveness of new phenyl silicone rubbers has improved, further promoting the large-scale adoption of liquid cooling technology in supercomputing centers and distributed computing nodes.
IOTA FLSR3000 fluorosilicone sealant